Soder‑Wick Lead‑Free is the state of the art in desoldering technology. It is specially designed for removal of today's high temperature lead‑free solders. The single layer weave used for Soder‑Wick Lead‑Free braid is lighter in mass than any other desoldering braid available and allows for lead‑free solder removal at lower temperatures. Soder‑Wick Lead‑Free responds faster than any other conventional desoldering braid. This unique design minimizes overheating and requires less contact time, thus preventing heat damage to the PCB and sensitive components. For Lead‑Free rework, Soder‑Wick has the answer.
All wick is sealed in nitrogen‑purged packaged to avoid corrosion and loss of performance from moisture and oxygen.
Engineered specifically for high temperature, lead‑free solders
Transfers heat to the solder joint more quickly and efficiently than conventional desoldering braids
Specifically designed for all lead‑free solders
Can also be used with Tin/Lead solders
Soder‑Wick Lead‑Free packaged in ESD‑safe static dissipative bobbins
Minimizes the risk of damage associated with static electricity
Non‑corrosive ultra high purity no‑clean flux
Will not leave ionic contamination on the boards
Especially effective at removing residual solder from SMT pads
RoHS Compliant
Patent Pending
Applications
Soder‑Wick Lead Free safely removes solder from all lead free applications