Kester

44 Series Image
  • High-Activity Rosin Flux
  • High Mobility and Fast-Spreading
  • Excellent Solderability to a Wide Variety of Metallizations
  • Flux Residue is Non-Corrosive and Non-Conductive under Normal Conditions of Use
  • Classified as ROLO per J-STD-004
Kester 44 Rosin Flux is an activated rosin formula for use in flux-cored solder wire. Kester 44 Rosin Flux has virtually dominated the field of activated rosin core solders for well over four decades. An outstanding performance feature of this flux is the "instant-action" wetting behavior. The high mobility and fast-spreading action of this flux results in more reliable production line soldering.
2235 Series Image
  • High Activity
  • Minimizes Icicling and Bridging
  • Chemically Compatible with most Solder Masks and Board Laminates
  • High Ionic Cleanliness and No Surface Insulation Resistance Degradation
  • Excellent Choice for Surface Mount Boards
  • RoHS Compliant
Kester 2235 is a high activity, organic flux designed for automated soldering of circuit board assemblies where a more aggressive flux is required, but reliability considerations are paramount. Featuring low solids, 2235 flux is ideal for soldering circuit assemblies with surface mounted components. Low solids mean fewer skips on bottom side surface mount pads. The residue after soldering is effectively removed in standard water cleaning systems. Although possessing high activity, boards exhibit high ionic cleanliness after water cleaning, exceeding the requirements of MIL-P-28809. The minimal amount of flux residue after soldering results in longer life for deionizing resin beds in closed loop water recycle systems. No offensive odors or excessive smoke is emitted during soldering. The flux will not create excessive foaming in standard water cleaning systems.
2331-FX Series Image
  • High Activity
  • Minimizes Icicling and Bridging
  • Chemically Compatible with most Solder Masks and Board Laminates
  • pH Neutral Chemistry
Kester 2331-ZX is an innovation in organic acid water-soluble flux chemistry for soldering circuit board assemblies. This unique, neutral pH chemistry flux provides the best ionic cleanliness of any organic water-soluble flux available to the electronics industry. This popular flux has been used for soldering critical assemblies in the computer, telecommunications and other industries. No offensive odors will be emitted during soldering. Kester 2331-ZX will not create excessive foaming in standard water cleaning systems. Kester 2331-ZX has good soldering properties for improved productivity without sacrificing reliability of the assembly. This flux does not attack properly cured solder masks or FR-4 epoxy-glass laminate. Kester 2331-ZX is not detrimental to the surface insulation resistance of the soldered assembly. Use of this flux minimizes cleaning costs while complying with environmental regulations.
951 Series Image
  • Improves Soldering Performance
  • Eliminates the Need and Expense of Cleaning
  • Non-Corrosive Tack-Free Residues
  • Classified as ORL0 Per J-STD-004
  • Compliant to Bellcore GR-78
Kester 951 is a halogen-free, non-rosin organic flux designed for wave soldering conventional and surface mount circuit board assemblies. The extremely low solids content (2%) and nature of the activator system results in practically no residue left on the assembly after soldering. Boards are dry and cosmetically clean as they exit the wave solder machine. There are no residues to interfere with electrical testing. Kester 951 exhibits improved soldering performance to minimize solder bridges and excessive solder defects. This flux is suitable for automotive, computer, telecommunications and other applications where reliability considerations are critical. The surface insulation resistance on soldered boards is higher than that provided by typical organic water-soluble fluxes. Kester 951 contains a corrosion inhibitor such that no corrosion products are formed when bare copper surfaces are exposed to humid environments.
959T Series Image
  • Minimize Micro-Solderballs
  • Extremely Shiny Joints
  • No Streaky, White Residues
  • Improves Soldering Performance
  • Eliminates the Need and Expense of Cleaning
  • RoHS Compliant
Kester 959T is a no-clean, non-corrosive, liquid flux that is designed for the wave soldering of conventional and surface mount circuit board assemblies. Kester 959T was developed to minimize the formation of micro-solderballs during wave soldering operations. This flux contains a small percentage of rosin, which improves solderability, heat stability and surface insulation resistance. Kester 959T offers the best wetting and the shiniest solder joints of any no-clean, solvent-based chemistry. Kester 959T leaves evenly distributed residues for the best cosmetic appearance.
977 Series Image
  • Biodegradable at pH of 2.0 or Greater
  • Chemically Compatible with most Solder Masks and Board Laminates
  • Does not Degrade Surface Insulation Resistance
  • No Offensive Odors
  • Bright, Shiny Solder Connections
Kester 977 is and organic water-soluble, water-based, no-clean chemistry for high quality soldering of electronic circuit board assemblies. Designed for wave soldering applications, Kester 977 provides good wetting on most surface finishes. The flux was specifically designed to reduce bridging, which is commonly associated with VOC-free no-clean fluxes.
979 Series Image
  • Biodegradable at pH of 2.0 or Greater
  • Chemically Compatible with most Solder Masks and Board Laminates
  • Does not Degrade Surface Insulation Resistance
  • No Offensive Odors
  • Bright, Shiny Solder Connections
Kester 979 is a VOC-free, no-clean flux formulation for high quality, low-defect soldering of electronic circuit board assemblies. This flux's finely tuned activation system offers the best wetting available in VOC-free liquid flux technology and the shiniest solder joints. Kester 979 also reduces micro solderballing on glossy laminates and between connector pins. Kester 979 will not attack properly cured solder masks of FR-4 Epoxy-glass laminate. Kester 979 leaves a minimal amount of residue after soldering. All remaining residues are non-corrosive, non-conductive and do not need to be removed.
ULTRAPURE Series Image
Manufactured by a special process that controls the inclusions of oxides and metallic and non-metallic impurities, Kester Ultrapure is the industry standard bar solder for use in high tech electronic applications where lower surface tensions and hole filling ability are essential. The purity of Kester Ultrapure meets the requirements of IPC/J-STD-006B.
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