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44 Series Image
  • High-Activity Rosin Flux
  • High Mobility and Fast-Spreading
  • Excellent Solderability to a Wide Variety of Metallizations
  • Flux Residue is Non-Corrosive and Non-Conductive under Normal Conditions of Use
  • Classified as ROLO per J-STD-004
Kester 44 Rosin Flux is an activated rosin formula for use in flux-cored solder wire. Kester 44 Rosin Flux has virtually dominated the field of activated rosin core solders for well over four decades. An outstanding performance feature of this flux is the "instant-action" wetting behavior. The high mobility and fast-spreading action of this flux results in more reliable production line soldering.
H3 Series Image
  • Small and Compact Size
  • Portability for Small Projects or Field Service
  • Perfect for Pocket, Toolbox, or Workbench
  • Standard 16 Gauge or Fine-Line 20 Gauge Size
  • Self-Feeding Dispenser
  • Rosin Core
  • Classic 60/40 Lead/Tin Alloy
6000 Series Image
  • 14, 16, or 20 Gauge Wire Solder
  • One-Half or One Pound Spools
  • Rosin Core
  • Three Popular Alloys Available
  • Classic 60/40, Low-Melt, or Silver-Bearing Alloy
CircuitWorks No Clean Flux Dispensing Pen Series Image
CircuitWorks Flux Dispensing Pens are designed specifically to apply each type of flux with precision control. The No Clean Flux Dispensing Pen precisely applies a patented noncorrosive, halide-free, organic low solid flux. This flux meets Bellcore TR-NWT-000078 and IPC SF-818 for surface insulation resistance.
CircuitWorks Flux Dispensing Pens provide controlled and exact applications that are generally compatible with most materials in the electronics industry. Dispense flux on printed circuit boards, heat sinks, chip carriers, switches, sockets and much more. CircuitWorks Flux Dispensing Pens are fast drying, completely portable and have minimal excess flux waste.
  • Chisel tip marker provides exact delivery of flux to surface
  • Applies a patented noncorrosive, halide free, organic no-clean flux
  • Flux meets Bellcore TR-N-NWT-000078 and IPC SF-818 for Surface Insulation Resistance
  • Flux meets ANSI/IPC J-STD-004, Type ROL0
  • RoHS compliant
CircuitWorks No Clean Tacky Flux Series Image
CircuitWorks No-Clean Tacky Flux is a Type ROL0 formulation designed for BGA rework requiring high-reliability, stability and cleanliness. CircuitWorks® No-Clean Tacky Flux gel composition holds the BGA component in position even with board movement. Its lower viscosity allows easy application and contains no ionic material. CircuitWorks No-Clean Tacky Flux is suitable for clean room applications.
  • Syringe applicator provides exact delivery of flux to surface
  • Long tack time, extended shelf life
  • No refrigeration required
  • Excellent consistency with stable viscosity
  • Noncorrosive, halide and halogen free
  • Meets IPC requirements for ROL0, No Clean
  • Conforms to ISO 9454
  • Meets Bellcore TR-NWT-000078 requirements
  • Meets DIN EN 29454-1 1.1.3.C classification
  • RoHS Compliant
  • Applications
    • Automated BGA applications
CircuitWorks Rosin Flux Dispensing Pen Series Image
CircuitWorks Flux Dispensing Pens are designed specifically to apply each type of flux with precision control. The Rosin Flux Dispensing Pen quickly applies a noncorrosive type R flux. This flux meets MIL-F-14256 E and F.
  • Chisel tip marker provides exact delivery of flux to surface
  • Applies a noncorrosive, nonconductive Type R flux
  • Flux meets MIL-F-14256 F Type R and ANSI/IPC J-STD-004, Type ROL0
  • Easily removed with Flux-Off Rosin or CircuitWorks Rosin Flux Remover Pen
  • RoHS compliant
CircuitWorks Water Soluble Flux Dispensing Pen Series Image
CircuitWorks Water Soluble Flux Pen is designed specifically to apply water soluble flux with precision control. The Water Soluble Flux consists of a neutral pH organic water soluble flux compatible with most solder masks. The high activity organic product cleans easily with water, reducing cleaning cost.
  • Applies a neutral pH organic water soluble flux for rapid soldering
  • Chisel tip marker provides exact delivery of flux to surface
  • Flux meets ANSI/IPC J-STD-004, ORH1 Classification
  • Easily removed with water
  • RoHS compliant
2235 Series Image
  • High Activity
  • Minimizes Icicling and Bridging
  • Chemically Compatible with most Solder Masks and Board Laminates
  • High Ionic Cleanliness and No Surface Insulation Resistance Degradation
  • Excellent Choice for Surface Mount Boards
  • RoHS Compliant
Kester 2235 is a high activity, organic flux designed for automated soldering of circuit board assemblies where a more aggressive flux is required, but reliability considerations are paramount. Featuring low solids, 2235 flux is ideal for soldering circuit assemblies with surface mounted components. Low solids mean fewer skips on bottom side surface mount pads. The residue after soldering is effectively removed in standard water cleaning systems. Although possessing high activity, boards exhibit high ionic cleanliness after water cleaning, exceeding the requirements of MIL-P-28809. The minimal amount of flux residue after soldering results in longer life for deionizing resin beds in closed loop water recycle systems. No offensive odors or excessive smoke is emitted during soldering. The flux will not create excessive foaming in standard water cleaning systems.
2331-FX Series Image
  • High Activity
  • Minimizes Icicling and Bridging
  • Chemically Compatible with most Solder Masks and Board Laminates
  • pH Neutral Chemistry
Kester 2331-ZX is an innovation in organic acid water-soluble flux chemistry for soldering circuit board assemblies. This unique, neutral pH chemistry flux provides the best ionic cleanliness of any organic water-soluble flux available to the electronics industry. This popular flux has been used for soldering critical assemblies in the computer, telecommunications and other industries. No offensive odors will be emitted during soldering. Kester 2331-ZX will not create excessive foaming in standard water cleaning systems. Kester 2331-ZX has good soldering properties for improved productivity without sacrificing reliability of the assembly. This flux does not attack properly cured solder masks or FR-4 epoxy-glass laminate. Kester 2331-ZX is not detrimental to the surface insulation resistance of the soldered assembly. Use of this flux minimizes cleaning costs while complying with environmental regulations.
951 Series Image
  • Improves Soldering Performance
  • Eliminates the Need and Expense of Cleaning
  • Non-Corrosive Tack-Free Residues
  • Classified as ORL0 Per J-STD-004
  • Compliant to Bellcore GR-78
Kester 951 is a halogen-free, non-rosin organic flux designed for wave soldering conventional and surface mount circuit board assemblies. The extremely low solids content (2%) and nature of the activator system results in practically no residue left on the assembly after soldering. Boards are dry and cosmetically clean as they exit the wave solder machine. There are no residues to interfere with electrical testing. Kester 951 exhibits improved soldering performance to minimize solder bridges and excessive solder defects. This flux is suitable for automotive, computer, telecommunications and other applications where reliability considerations are critical. The surface insulation resistance on soldered boards is higher than that provided by typical organic water-soluble fluxes. Kester 951 contains a corrosion inhibitor such that no corrosion products are formed when bare copper surfaces are exposed to humid environments.
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