Heat Sink Compound is a thermally conductive grease applied under power transistors and other heat generating devices. Compound assists in the transfer of heat to a metal chassis or heat sink for dissipation. Other typical electronic applications include thermocouple wells, thermistors, and calrods. Silicone‑Free Heat Sink Compound is ideal for applications where silicone contamination hurts solderability and increases solder defects.
